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Major News in COMSOL Multiphysics® Version 6.1
General Updates
- Application Builder: resizable and detachable windows in apps
- Model Manager: version control of reports and CAD assemblies
- Optimization Module: topology optimization with manufacturing constraints for milling
- Uncertainty Quantification Module: multidimensional interpolation and inverse UQ
- Visualizations with direct shadows
- Mesh repair for misaligned CAD models
- Powerful new Find and Replace tool
- Interface for Microsoft® Word
Electromagnetics
- Electric circuit extraction
- Tools for motor winding layouts and magnet arrays
- Magnetohydrodynamics simulations, including a library of liquid metals
- Electric discharge simulations
- Efficient modeling of periodic structures for electromagnetic waves
- Fluence rate calculations for ray optics
- Combined inductively and capacitively coupled plasmas
Structural Mechanics
- Faster and more robust contact for solids, shells, and membranes, including full support for self-contact
- Nonlinear materials in thin layers for the analysis of gaskets and adhesive layers
- Weld evaluation for joined structural shells
- Numerical testing of material models
- Analysis of cable or wire systems
- Wear analysis for shells and membranes
- Shear force and moment diagrams for beams
- Modeling of pyroelectricity
Acoustics
- Up to 40% faster solver for elastic–acoustic waves and more than 2 billion degrees of freedom
- Acoustic streaming for acoustically driven fluid flow
- Lumped boundary and port features for thermoviscous acoustics in microtransducers
- Thermoviscous acoustic damping of MEMS devices
- Explicit solvers for combining piezoelectricity, structural mechanics, acoustics, and fluid flow
- Fracture boundary condition for elastic waves
Fluid & Heat
- CFD with detached eddy simulation (DES)
- Turbulent flow in porous media coupled with flow in open media
- High Mach number reacting flow
- Radiative loads on satellites in orbit
- Easier coupling of shells and solids in heat transfer models
Chemical & Electrochemical
- Dispersed multiphase flow with chemical species transport and reactions
- Shrinking core feature for heterogeneous reactions in porous media
- New Battery Pack interface for modeling battery packs with several hundred cells
- Thermal analysis and thermal runaway in 3D models
- Functionality for modeling impurities from sulfuric compounds, heavy hydrocarbons, and ammonia in fuel cells
CAD Import Module, Design Module, and LiveLink™ Products for CAD
- Offset and transform faces operations for parameterizing and optimizing imported CAD models
- Automatic simplification of imported ECAD layouts for faster meshing and solving
- Support for the most recent versions of CAD file formats
Platform and Hardware Support
- Linux® operating system support on ARMv8 processors
- Performance improvements on Apple silicon (M-series) processors
Apple is a trademark of Apple Inc., registered in the U.S. and other countries. Linux is a registered trademark of Linus Torvalds in the U.S. and other countries. Microsoft is a trademark of the Microsoft group of companies.
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